ZETA-300: PRECISION SURFACE METROLOGY

  • Patented ZDotTM technology delivers high repeatability
    • LED patterned/etched substrates
    • Photo-resist and stacked structures
    • Transparent surfaces
  • Rapid, reliable data acquisition
    • <10 sec per scan with optional equipment
    • Operator-friendly, easy to learn GUI
    • Dependable results without constant recalibration
  • Automated data capture and analysis
    • PSS Bump Diameter, Height and Pitch
    • Export to 3rd party analysis software

Reliable Results and Data

The Zeta-300 provides integral acoustic isolation to reduce the effects of sound and air currents on sample measurements.  When gathering data on structures that are less than 1µm high, even small vibrations caused by sound and air disturbances can affect your results.  Coupled with an optional isolation table, the Zeta-300 delivers accuracy and repeatability unmatched by other optical profilers.

Flexible Hardware & Software Options

In research, it is often unpredictable what type of surface you will need to measure.  With this in mind, the Zeta-300 has a modulear design that allows for a wider range of hardware measurement options as well as software packages:

  • Film Thickness Spectrometer
  • QDIC/Nomarski for nanometer-scale roughness
  • iX5 hybrid interferometer objective
  • Piezo stage for 3nm Z-resolution
  • Tilt stages, sample holders and vacuum chucks
  • Auto feature detect/measure software
  • Auto surface area calculation, statistical analysis

...and much more!

Application-Specifific Metrology

  • LED, PSS & PEC analysis

    • Auto Height, Diameter & Pitch for PSS
    • Analyze photo-resist or post-etch PSS bumps
    • Auto feature detect, roughness for post-epi mesa analysis
    • 2”, 4” & 6” wafer vacuum chucks
  • Solar cell and wafer analysis

    • Auto Finger Height, Width & Volume
    • Poly-Si and Mono-Si Surface Area & Texture
    • Silicon-NItride AR Film Thickness
    • Multi-site and auto finger detect
    • 156mm solar wafer vacuum chuck
  • Micro-fluidics and MEMS analysis

    • Transparent multi-surface profiling
    • Deep trench/well & high aspect ratio feature profiling
    • Programmable cursors and cross-sections
  • EZ Metrology

    • Multi-site sequences & multi-FOV 3D image stitching with autostage option
    • Auto Slope & waviness compensation
    • Auto Surface leveling
    • Auto Feature height, dimensions, angle, area
    • Auto Linear and areal roughness